What are the best solder joint technology currently available to purchase? This article attempts to give you some answers to guide you in the process of purchasing the best solder joint technology to suit your needs. In our buying guide, we outline certain features to consider when buying solder joint technology. It is important to take time and research before you commit to purchasing.
Best solder joint technology
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1. MAIYUM 63-37 Tin Lead Rosin core solder wire for electrical soldering (0.8mm 50g)
Feature
Tin Lead Solder Wire: High Quality Rosin Core Solder WireParameters: solder wire Tin 63%- Lead 37% (Sn63-Pb37)
Flux content 1.8%electrical soldering wire dia is 0.8mm (0.0315inch)gross weight 50gram (0.11lbs),good size for pocket
Low Melting Point: 361F/183C. easy to be soldered, flows smoothly, soldering fast and strong soldering point.
Applications: Very good soldering capability, esp for circuit board, DIY, home improvement, Repairation of cable/TV/Radio/sterro/ Toys and other electrical devices etc.
Description
Product Name: Fluxed Rosin Core Solder Wire Parameters: Tin 63% Lead 37% (Sn63-Pb37) Flux Content: 1.8% Melting Point:Soldering Wire 361F/183C,0.8mm(0.0315inches), Gross Weight: 50g(0.11lbs/1.61Ounces) Soldering Wire Reel Size- 55mm dia x 30mm(2.165in dia x 1.181 in) Package: 1 pc x 0.8mm 50gram Solder Wire Spool Special Features: Perfect soldering capability, Lower melting point, Soldering Flows more smoothly, much stronger soldering point,easier to use Full refund guaranteed within 30days if you are not satisfied with the quality.2. Solder Joint Technology: Materials, Properties, and Reliability (Springer Series in Materials Science)
Description
The European Unions directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
3. Canfield Dgs Solder - 1 Lb
Feature
Lead-Free - works and gives the finished appearance of 60/40Ideal to use when making jewelry or anything that will be in contact with skin
Convenient 1 lb spool
Description
Glass artists need a very specific mix of alloys in their solder to get a smooth and clean bead on their work. Lead-free solder is ideal for projects that will be handled frequently or worn, or in workshops and classrooms that need to stay lead free. DGS works and gives the finished appearance of 60/40, excellent flow characteristics, runs an exceptional bead and is environmentally safe and easy to use. The DGS melts solid to liquid 415 - 490 F. Sold in a 1 lb. spool.Delphi Tip: Lead-Free Solder should be used when making projects where your skin comes in contact with it, such as jewelry, boxes and kaleidoscopes.
Soldered jewelry shown made by artist Shannon Jones. From Delphi's Online Artist Gallery.
4. Solder Joint Reliability: Theory and Applications
Description
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.5. Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Description
This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry's need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors explain the fundamentals of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.6. Solder Joint Reliability Prediction for Multiple Environments
Description
Solder Joint Reliability Prediction for Multiple Environmentswill provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space,and automotive industries.
7. Modern Solder Technology for Competitive Electronics Manufacturing
Description
Solder remains the most common interconnecting material for electronic packaging and assembly. Yet, as various technologies have advanced, so too have the manifold uses to which solder is put. This comprehensive volume details all of the most current soldering techniques, along with the fundamental principles involved in each process. And it clearly relates those principles directly to practical applications encountered in today's electronics manufacturing environments. Ideal for material and process troubleshooting, the book also includes solder data tables for quick reference.8. UbiGear Wire Connector Solder Seal Heat Shrink Electrical Butt Connectors Terminals Insulated Marine Waterproof Automotive Copper Splice (12-10 AWG (50 Pcs))
Feature
High Quality - Shrinking ratio: 2:1. Working temperature: -67F to +257F (or -55C to +125C)Easy Operation - Transparent sleeve provides easy inspection when strip and insert wires inside.
More Effective Way - Waterproof and work with 10/12/14/16/18/20/22/24/26 AWG wire.
50 Pcs Yellow Heat Solder for 12-10 AWG wire.
UbiGear heat shrink connectors are ROHS/ISO 9001:2008/SGS/CE certified.
